Latest Electronics News
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Ennovi has introduced a 10Gbit/s Ethernet connector with USCAR interface and press-fit PCB pins. Called Ennovi-Net, “this innovation completely avoids the need for soldering”, the company said. “As solder usage ...
The post Automotive 10Gbit/s+ Ethernet connector has push-fit PCB pins appeared first on Electronics Weekly.
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A new take on the concept of digital twins was announced by Nvidia at its developer conference in San Jose this week, as founder and CEO, Jensen Huang announced that ...
The post Nvidia offers Omniverse Cloud as APIs appeared first on Electronics Weekly.
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Here, 63 years ago, is an ad from Electronics Weekly’s edition of February 1st 1961
The post Tighter-Than-Ever-Specifications For Fast-Switching Low-Wattage Transistors appeared first on Electronics Weekly.
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As accelerated computing reaches its tipping point, Nvidia’s CEO explained the company’s plan is not to drive down costs but to scale up performance. He was speaking at Nvidia GTC ...
The post Blackwell GPU shares Hopper architecture but ramps up performance appeared first on Electronics Weekly.
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Corning has created an optical fibre connector system that aligns 12 fibres in a single operation to bring data to homes. “Multifiber Pushlok is a ‘stick-and-click’ [that] allows operators to ...
The post Multiple fibres aligned in a single connector for street installation appeared first on Electronics Weekly.
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The 222-microcircuit project described earlier in [1-3] is an analog of the 555 microcircuit. Her main purpose is the generation of rectangular pulses with an adjustable fill factor and independent frequency control. Such a chip is not produced industrially, although it is not difficult to a
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The Digital Markets Act (DMA) – the EU’s move to rein in the power of big tech companies – went into effect earlier this month. The six-month grace period for ...
The post The Gate-Keepers appeared first on Electronics Weekly.
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Time once more to do a periodic roundup of our recent Gadget book previews, from the realms of electronics, gadgetry, or general technology...
The post Gadget Book library extends its virtual shelves appeared first on Electronics Weekly.
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Integrated engineering and gas specialist Kelington has launched wholly owned subsidiaries in Germany and Hong Kong to capitalise on the 'surging demand for chips'.
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Dutch lithography firm ASML is supporting its home country by supporting the Eindhoven-based DeepTechXL fund. It invests in firms doing work in quantum, photonics and other complex engineering fields.
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Hundreds of school children in the North East participated in this year’s First Lego League STEM (science, technology, engineering and maths) education competition. “This event is focussed on removing stereotypes ...
The post Lego league gets children thinking STEM in the North East appeared first on Electronics Weekly.
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Korea's SK Innovation, which is owned by Korea's SK Group, has liquidated its Blue Dragon Energy division in order to streamline operations in China.
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Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.
In other words, a back-end packaging facility will follow the front-end fab to complement th
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Taiwan Semiconductor Manufacturing Company has announced plans to construct two new chip-on-wafer-on-substrate plants in Chiayi. But there's also speculation it will expand its capacity in Japan too.
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India's RRP Electronics has teamed up with a consortium of unnamed European companies to construct the first OSAT semiconductor facility in the Maharashtra region.
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Now in its sixth year of awards, EW BrightSparks sees Electronics Weekly highlight and celebrate some of the brightest and most talented young engineers in the UK today. Here, in ...
The post EW BrightSparks 2023: Ifaz Uddin, Imperial College London appeared first on Electronics Weekly.
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The post ABLIC Seeks to Reinforce Its Position in the European Automotive Sector with New Focus on High-Value-Added Products appeared first on Electronics Weekly.
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Earlier in January this year, Luxshare ICT (Europe) celebrated its tenth anniversary. Although the Luxshare name has a much longer history, its success in Europe necessitated reshaping its identity to conquer new frontiers.
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The Department of Commerce’s National Institute of Standards and Technology (NIST) is setting aside USD 70 million to improve the deployment of AI in manufacturing.
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Apple has announced TSMC and Murata among the cohort of new supporters of its Restore Fund, which is designed to scale global investment in carbon removal projects.
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The high-bandwidth memory (HBM) landscape, steadily growing in importance for its critical pairing with artificial intelligence (AI) processors, is ready to move to its next manifestation, HBM3e, increasing data transfer rate and peak memory bandwidth by 44%. Here, SK hynix, which launched the first HBM chip in 2013, is also the first to offer HBM3e validation for Nvidia’s H-200 AI hardware.
HBM is a high-performance memory that s
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Outfitted with an Arm Cortex-7 core running at up to 600 MHz, ST’s STM32H7R/S MCUs provide the performance, scalability, and security of a microprocessor. They embed 64 kbytes of bootflash and 620 kbytes of SRAM on-chip to speed execution, while fast external memory interfaces support data transfer rates up to 200 MHz.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497270" src="https://www.edn.com/wp
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An off-the-shelf S-Band low-noise amplifier, the TDLNA2050SEP from Teledyne, tolerates up to 100 krads of total ionizing dose (TID) radiation. This makes the part suitable for use in high-reliability satellite communication systems and phase-array radar.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497273" src="https://www.edn.com/wp-content/uploads/Teledyne-TDLNA2050SEP.jpg?resize=800%
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Astera Labs has expanded its Aries PCIe/CXL Smart DSP retimer portfolio with devices that ensure robust PCIe 6.x and CXL 3.x connectivity. Doubling bandwidth to 64 GT/s per lane with automatic link equalization, Aries 6 retimers enable critical connectivity for AI server platforms and cloud infrastructure.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497276" src="https://www.edn.com
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Embedded developers can deploy AI and ML models developed on Edge Impulse’s platform directly in Arm’s Keil microcontroller development kit (MDK). The partnership between the two companies makes it easier for engineers to collaborate with other cross-disciplinary teams to build edge AI products and bring them to market.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497279" src="https://w
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Alphawave Semi announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s advanced 3-nm process. The silicon-proven Universal Chiplet Interconnect Express (UCIe) subsystem, capable of operating at 24 Gbps per lane, was demonstrated at the recent Chiplet Summit in Santa Clara, CA.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-
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Modern system-on-chip (SoC) designs require multiple interconnects for optimal performance, and here, cache coherent and non-coherent interconnects work together. In fact, it’s imperative that SoCs have an efficient combination of cache-coherent and non-coherent operations.
While SoC parts like accelerators and peripherals generally don’t require cache coherency, sharing a coherent view of memory and I/O is critical, so
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When a load is driven simultaneously by more than one source with each source being of its own frequency, the individual load power deliveries from those sources are independent of each other. Whatever power any one of those sources would provide to the load all by itself, that power delivery will not be affected by the presence of the absence of the other sources.
Imagine a stack of voltage sources connected in series and feeding into some load resistance, R. It could look something like Figure...