Latest Electronics News
-
Littelfuse is expanding its solid-state switching portfolio with the SCD and SCP Series solid-state contactors for control in single- and three-phase heating and motor applications. Designed to improve system performance […]
The post Littelfuse solid-state contactors for heating, motor control apps appeared first on Electronics Weekly.
-
Evertiq Expo brought 908 people from 456 companies to Svenska Mässan in Gothenburg on 17 September. 496 visitors from 307 companies were welcomed by 149 exhibiting companies. The day featured a broad conference programme covering the semiconductor market, component management, circularity and the evolving EMS industry.
-
The European Space Agency (ESA) has awarded two contracts – one to ICEYE and one to Leonardo – to carry out architecture studies for the EU’s planned Earth Observation Governmental […]
The post ESA selects Iceye, Leonardo for Europe’s EOGS studies appeared first on Electronics Weekly.
-
Back in 1998 people were. starting to get exercised by the Millennium Bug – the spectre which turned out to be a squib. In March 1998 EW wrote: ‘Prime Minister […]
The post The Spectre Which Turned Out To Be A Squib appeared first on Electronics Weekly.
-
The funding will be deployed across R&D on H-DES, the recruitment of quantum researchers and domain expert engineers, expansion of hardware, academic and industrial partnerships, and international growth to prepare for scale.
-
When Mareike Haass took to the stage at Evertiq Expo in Gothenburg on September 17, she presented what in4ma describes as the first complete ranking of Europe's 100 largest EMS companies, built on data sourced directly from national company registers and the companies themselves. The full list is now available.
-
Chime in with your suggestions in the comments. We'll even allow the mechanical engineers out there to participate. Well...maybe.
The post Some tips for electrical engineers appeared first on EDN.
-
Seven μSMARC modules based on NXP i.MX processors will be available as CUBOs on the CELUS Design Platform, giving engineers guided access to SomDevices’ power-efficient modules at the point where hardware architecture is decided.
-
The investment will be deployed towards deepening R&D in India, expanding the domestic semiconductor supply chain and developing future talent. The US company also plans to establish a 140-acre advanced semiconductor research park in India.
-
The stacks will be supplied in phases through the second half of 2027. Reverion’s next-generation fuel cell systems equipped with Doosan Fuel Cell’s SOFC stacks will be supplied to eco-friendly power generation facilities in Germany and other European markets.
-
Samtec, the connector specialist, has released its 1.0 mm vertical compression mount board connector, the 100-CM Series. It is aiming at millimeter-wave test and measurement applications for W-band and into […]
The post Samtec’s 100-CM Series connectors capable of DC to 120 GHz appeared first on Electronics Weekly.
-
There's Google's ballooning datacentre capex, Imec demonstrating 22nm pitch on a single-print high-NA step and a semiconductor that changes its properties in response to light.
The post Most read – Mediatek processor, Racks not chips, Google capex appeared first on Electronics Weekly.
-
Under the agreement, Qolab will serve as a lead customer on SkyWater’s newly launched SC250 superconducting platform to advance its Quantum System-in-Package (QSiP). QSiP architecture is designed to address cost, complexity and form-factor challenges in scaling quantum systems.
-
The Trump administration takes an uncertain hand into critical technology negotiations with China next week, writes Paul Dempsey. Mounting controversy over AI safety and regulation spilled over into great power […]
The post Dealing in AI – who holds the cards? appeared first on Electronics Weekly.
-
Here is how SEU detection, recovery, and validation work for FPGAs in ground-based and terrestrial applications.
The post FPGA architecture: SEU detection and recovery strategies appeared first on EDN.
-
The ultra-high-voltage (UHV) transformers will be deployed at newly built AI data centers in the northern and southern regions of the US. They consist of 765kV UHV transformers worth USD 163 million and 345kV UHV transformers worth USD 124 million.
-
Čibuk 2 sits alongside the 158MW Čibuk 1 wind farm in Serbia’s South Banat region. Together, the two projects have a total installed capacity of 312MW. The combined projects represent more than EUR 500 million of FDI in Serbia’s energy infrastructure.
-
Nexperia, whose Chinese owner Wingtech was stripped of control by a Dutch court, has joined up with Tata Electronics on Thursday to fab and package ICs in India. Nexperia will […]
The post Tata and Nexperia join in far-reaching jv appeared first on Electronics Weekly.
-
Yesterday, Huawei showed off 10 AI chipsets including AI accelerators, CPUs and networking. “Among these chips, Ascend is the most critical one in the entire system,” said Huawei chairman David […]
The post Huawei launches ten AI chipsets appeared first on Electronics Weekly.
-
Worldwide spending on AI is forecast to total $2.7 trillion in 2026, a 49.5% increase year-over-year, according to Gartner. “The buildout of AI data center capacity is the largest infrastructure […]
The post 2026 AI spend to hit $2.7trn appeared first on Electronics Weekly.
-
Imec’s most advanced hyperspectral sensor for Earth observation and industrial applications has officially transitioned from the research and development phase to broader adoption by imaging system developers and application partners. […]
The post Imec’s most advanced hyperspectral sensor for sale appeared first on Electronics Weekly.
-
Hermeus will produce the engines using its rapid-build production model while adhering to Pratt & Whitney's global standards for quality, safety and site‑activation.
-
A new architecture uses the silicon wafer itself as the package to achieve higher power density and improve system performance.
The post Highly integrated approach to power system design in the AI era appeared first on EDN.
-
Want to network-connect gear using wired Ethernet? Or optical fiber? How about a bandwidth boost? Or a range extension? SFP does it all.
The post SFP: Add-in module delivers diminutive performance, flexibility appeared first on EDN.
-
The ST SafeSense VD56GA 1.1-Mpixel automotive image sensor enables infrared in-cabin sensing for driver and occupant monitoring applications.
The post Sensor sharpens infrared in-cabin imaging appeared first on EDN.
-
Vishay’s XFD11KxxCA flat-clamping TVS devices provide 11 kW of peak pulse power dissipation at 10/1000 µs.
The post Transient voltage suppression devices reach 11 kW with flat clamping appeared first on EDN.
-
Singular Photonics’ Litavis is a CMOS SPAD image sensor with integrated digital photon processing on-chip and in-pixel.
The post SPAD sensor processes photon events on-chip appeared first on EDN.
-
Anti-surge chip resistors in Rohm’s SDR01 series deliver a rated power of 0.33 W in the 0402 (1005 metric) package.
The post Anti-surge resistors reduce component count appeared first on EDN.
-
Renesas offers the RZ/G3L and RZ/G3SE series of 64-bit general-purpose microprocessors for consumer and industrial HMI and IoT edge systems.
The post Pin-compatible MPUs simplify product variants appeared first on EDN.
-
Single event upsets (SEUs)—transient bit flips induced by alpha particles, high energy neutrons, and thermal neutrons—are a reliability concern.
The post FPGA architecture: Radiation particle types and single event upsets (SEUs) appeared first on EDN.