Latest Electronics News
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Synaptics is introducing its SYN765x single-chip device for using AI at the edge with smart IoT devices. It combines support for real-time intelligence with integrated Wi-Fi 7, aiming at battery-powered ...
The post Synaptics SYN765x integrates Wi-Fi 7 and AI for smart devices appeared first on Electronics Weekly.
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DigiKey has collaborated with STMicroelectronics and Ultra Librarian for a new version of the eDesignSuite tool. eDesignSuite This is a free no-license-required online design platform developed by ST. It aims ...
The post DigiKey, ST, Ultra Librarian partner for eDesignSuite integration appeared first on Electronics Weekly.
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Intel’s efforts in the phone business did not end well, but 21 years ago, the company’s mobile targets were ambitious: ‘Thecnext decade will see the way people interact with computers ...
The post When Intel Was Bullish On Phones appeared first on Electronics Weekly.
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US-based energy technology company Lyten has announced plans to establish an industrial hub in Gdańsk, centred around a facility acquired from Northvolt in late 2025.
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Under the agreement, Soitec will provide POI wafers for Skyworks’ Sky5 platform to address RF requirements of today’s 5G smartphones. Soitec POI provides the performance necessary for seamless advanced coexistence in dense signal environments.
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With advanced semiconductor manufacturing still heavily concentrated in Taiwan, geopolitical tensions are forcing companies like Apple to reassess their supply chain strategies. The question is no longer if diversification is needed, but how quickly it can be achieved.
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A TLV431-based circuit solved LSI chip power-up failures by ensuring a sufficiently steep 5V rail rise time.
The post Vcc delay appeared first on EDN.
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Infineon plays a key role in Subaru’s integrated electronic control unit (ECU) for next‑generation advanced driver assistance systems (ADAS) and vehicle motion control.
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California-based Empirical Systems Aerospace (ESAero) is known for its engineering expertise, electric and hybrid propulsion capabilities, aerospace prototyping and AS9100 Certified UAS manufacturing.
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An edge server and PLC controller for industrial automation, field comms and IoT edge applications by Sefra Labs are based on Raspberry Pi 4 and 5. The Strato Pi Plus ...
The post Embedded: Raspberry Pi duo extends industrial IoT reach appeared first on Electronics Weekly.
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SWISSto12, the Swiss manufacturer of satellite and payload systems, has officially opened its purpose-built assembly facility at company headquarters in Renens, Switzerland. The facility will support the industrial-scale production of ...
The post SWISSto12 opens assembly facility for GEO satellites in Switzerland appeared first on Electronics Weekly.
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The second part on GaN basics explains hybrid structures and RDS(on) penalty while proving further details on HEMTs and substrate choices.
The post GaN fundamentals: Hybrid structures, HEMT, and substrate choices appeared first on EDN.
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the most read stories on our website cover TI's 800V DC power architecture for AI data centers, a quantum‑centric supercomputing reference architecture and Honda cancelling EV models.
The post Most Read – Honda cancels EVs, IBM quantum blueprint, Elon Musk fab appeared first on Electronics Weekly.
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The plant in Karnataka will focus on developing and manufacturing EV powertrain components, such as electric traction motors, motor controllers, power electronics and drivetrain systems, catering to vehicles and industrial applications.
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Under the terms of the cooperation agreement, Nuvve will provide project development consulting services and will serve as the grid aggregation operator, earning a 9% aggregation fee on all revenues generated by the Austrian project.
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Swedish EMS provider NOTE has acquired 100% of the shares in STI Enterprises Holdings Limited, a UK-based manufacturer of electronic solutions for the defence industry.
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The key leadership appointments across Southeast Asia and Oceania include Jason Yuan, President, SEA & ANZ; David Leal, Vice-President of Solution Business (Infrastructure), SEA & ANZ; and Lili Mow, Vice-President of Solution Business (Automation), SEA & ANZ.
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Imec has received the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today. The tool gives imec’s partners early access to the next generation of ...
The post Imec gets the world’s most advanced litho tool appeared first on Electronics Weekly.
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Yesterday Japan’s Prime Minister Sanae Takaichi and Singapore’s Prime Minister Lawrence Wong (pictured) agreed to form a strategic partnership in trade, technology and defence. ‘We uphold the international order based ...
The post Singapore and Japan agree wide-ranging partnership appeared first on Electronics Weekly.
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The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida. The ...
The post 76th ECTC appeared first on Electronics Weekly.
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Datacentre capex increased 57% in 2025 as AI deployments, complemented by general infrastructure investments, accelerated, says Dell’Oro, which expects hyperscalers and AI model developers to sustain strong capex momentum in ...
The post 2025 datacentre capex up 57% appeared first on Electronics Weekly.
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The MoU provides a collaborative framework aimed at fostering economic ties, enabling business growth, supporting joint initiatives, and reinforcing existing connections that contribute to the competitiveness and sustainability of the semiconductor ecosystem.
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A DC/DC power delivery board from Navitas Semiconductor enables direct conversion from 800 V to 6 V in a single stage.
The post Single-stage design removes 48-V bus in servers appeared first on EDN.
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The ST64UWB family of ultra-wideband SoCs from ST provides increased range and processing capability for automotive applications.
The post UWB SoCs extend ranging and radar performance appeared first on EDN.
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Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters and cloud data centers.
The post 224G ICs optimize signal integrity in linear optics appeared first on EDN.
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AOS has introduced two MOSFETs—the 25 V AONC40212 and 80 V AONC68816—in 3.3×3.3 mm source-down DFN packages with double-side cooling.
The post Double-side cooled MOSFETs reduce server heat appeared first on EDN.
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Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI data centers.
The post Buck ICs improve AI data center power appeared first on EDN.
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A cellular data service upgrade prompts new hardware acquisitions: four total devices. Smart or superfluous? Read on!
The post Cellular hotspots: Multi-option evaluation thoughts appeared first on EDN.
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The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs worldwide.
The post Scoping out the chiplet-based design flow appeared first on EDN.
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A single resistor linearizes the LMC555 timer's current-controlled oscillator, correcting internal delays across a five-decade range.
The post Improve 555 frequency linearity appeared first on EDN.